Eletronik 09/2015 - In how many dimensions SPI works?

Summary

This article shows advantages and disadvantages of different methods of solder paste inspection (SPI). Market offers devices with 2D or 3D technology. In the 2D technology the biggest advantage is that device can find almost every mistake connected to shape of solder paste spot like bridges, offset or pollutions. 3D technology is essential for height and volume of the solder paste. So, the best solution for SPI should be connection of 2D and 3D technology. Our supplier – MEK – has this outstanding solution in its offer, known as a 5D SPI inspection.

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